Experimental punching machine
Experimental punching machine
Main application areas: Suitable for pilot production and research and development of MLCC, chip inductors, piezoelectric ceramics, LTCC, multi-layer RF modules, multi-layer thick film sensors, fuel cells, solar cells, etc.
Basic parameters:
model | HSP-M01 |
Scope of workspace | ≤160mmx160mm within |
Punching thickness | ＜2mm |
hole spacing | 120x120mm(±0.01mm) within |
Punching size | Diameter 3.05mm ± 0.005 |
Equipment size | 270x200x260mm (length, width, height) |
working conditions | *No power required *Compressed air: ≥ 5.5 Kgf/cm2 |
Explanation: The above equipment can be customized according to customer requirements.
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